pcb|fpc|pcb manufacturer|quick turn pcb|circuit board|high frequency pcb|aluminium base pcb|assembly|深圳宏明旺电子 Prduction Capability
pcb|fpc|pcb manufacturer|quick turn pcb|circuit board|high frequency pcb|aluminium base pcb|assembly|深圳宏明旺电子 Process
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Engineer Item Manufacturing Capability
Material Type CEM-3,FR-4,FR-4-TG170/TG180,Halogen Free,Rogers,Arlon,Taconic,Isola,PTFE, Bergquist
Thickness 0.2~6.0mm
Production Type Surface Treatment HASL,HASL lead-free,Flash gold,Immersion gold,OSP,Gold Finger Plating,Selective thick gold plating, Immersion silver,Immersion tin, Carbon ink,Peelable Mask
No.of Layer 1L-26L
Cut Lamination Working Panel Size Max:650×1000mm
Inner Layer Inner Core thickness 0.1~2.0mm
Conductor Width/spacing Min:3/3mil
Alignment 2.0mil
Dimension Board Thickness Tolerance ±10﹪
Interlayer Alignment ±3mil
Drilling Drilling Diameter Min:0.15MM (Laser Drill:0.1MM)
PTH Tolerance ±0.076mm
NPTH Tolerance ±0.05mm
Hole Position Tolerance ±0.076mm
PTH+Panel Plating Hole Wall Copper Thickness ≥18um
Uniformity ≥90%
Aspect Ratio 12:1
Outer Layer Conductor Width Min:3mil
Conductor Spacing Min:3mil
Pattern Plating Finished Copper Thickness 1oz~6oz
Etching Under Cut ≥2.0
ENIG/Flash Gold Nickel Thickness ≥100u″
Gold Thickness 1~3u″
Solder Mask Thickness 10~25um
Solder Mask Bridge 4mil
Plug Hole Dia 0.3~0.6mm
Legend Line Width/Line Spacing 5/5mil
Gold Finger Nickel Thickness ≥120u″
Gold Thickness 1~80u″
Hot Air Solder Level Tin Thickness 100-300u″
OSP Membrane Thickness 0.2~0.4um
Routing Tolerance of Dimension ±0.1mm
Slot size Min.0.6mm
Cutter Diameter 0.8mm-2.4mm
Punching Outline Tolerance ±0.1mm
  Slot Size Min.0.7mm
V-Cut V-Cut Dimension Min.60mm
Angle 15°30°45°
Remain Board Thickness Tolerance ±0.1mm
Beveling Beveling Dimension 30-300mm
E-Test Testing Voltage 250V
Max.Dimension 540×400mm
Impedance Control Tolerance ±10%
Peel Strength   1.4N/mm
 
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