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Aluminum Nitride Ceramic Circuit Board Has High Carbon Resistance
96 Alumina Ceramic PCB
Ceramic Base PCB Board With Immersion Gold
Single-sided Ceramic Based PCB Board
Ceramic Substrate Circuit Board
Ceramic base PCB is refers to the joint directly to the copper foil in the high temperature alumina (Al2O3), aluminum nitride (AlN) and silicon nitride ceramic substrate (Si3N4) of special craft board, including ceramic substrate materials for its high strength, excellent insulation performance, good heat resistance, small thermal expansion coefficient of thermal conductivity, good chemical stability, etc are widely used in electronic packaging substrate.
Manufacturing Capacity
Advantages of ceramic substrate
Different from the traditional glass fiber FR4 substrate, the ceramic material has good high-frequency performance and electrical performance, and has high thermal conductivity, chemical stability, excellent thermal stability and other characteristics that other ordinary substrates do not have.
● High thermal conductivity and high temperature resistance
● Smaller coefficient of thermal expansion.
● Stronger and lower resistance.
● Good insulation performance.
● Low high-frequency loss.
● Excellent thermal stability.
Alumina substrate features:
● Good surface characteristics, providing excellent flatness and flatness.
● Good thermal shock resistance.
● Excellent oil and chemical resistance.
● Low warpage.
● Good stability in high temperature environment.
● Can be processed into various complex shapes.
Aluminum nitride substrate characteristics:
● High thermal conductivity, more than 5 times that of alumina.
● Low coefficient of thermal expansion, which can effectively reduce the thermal stress caused by thermal expansion.
● Higher electrical insulation and smaller dielectric constant.
● High mechanical strength and density.
● Excellent corrosion resistance to molten metal.
● Low dielectric loss and more stable reliability.
Silicon nitride substrate features:
● Has high thermal conductivity
● Good electrical insulation, high hardness
● Low dielectric constant and dielectric loss
● Excellent mechanical strength and thermal shock resistance
● Good anti-oxidation performance and good hot corrosion performance.
● High mechanical strength and density.
| Item | Maunfacturing Capability |
| Material base | Aluminium core PCB, Cu core PCB, Fe base PCB,Ceramic PCB etc Special Material(5052,6061,6063) |
| Surface Treatment | HASL, HASL L/F,ENIG,PlatingNi/Au,NiPdAu,Plating Sliver,Immersion Sliver, Immersion Tin,OSP,Flux |
| No.of Layer | Single-sided, Double-sided,4 layer Aluminium Base PCB |
| Board Size | max：1200*550MM / min：5*5MM |
| Conductor Width/spacing | 0.15MM/0.15MM |
| Warp and Twist | ≤0.75% |
| Board Thickness | 0.6MM-6.0MM |
| Copper Thickness | 35UM、70UM、105UM、140UM、210UM |
| Remain Thickness Tolerance | ±0.1MM |
| Hole Wall Copper Thickness | ≥18UM |
| PTH Hole Dia.Tolerance | ±0.076MM |
| NPTH Tolerance | ±0.05MM |
| Min.Hole Size | 0.2mm |
| Min. Punch hole Dimension | 0.8MMM |
| Min. Punch Slot Dimension | 0.8MM*0.8MM |
| Hole Position Deviation | ±0.076mm |
| Outline Tolerance | ±10% |
| V-cut | 30°/45°/60° |
| Min.BGA Pitch PAD | 20mil |
| Min. legend Type | 0.15MM |
| Soldemask Layer Min.Bridge width | 5mil |
| Soldemask film Min.Thickness | 10mil |
| V-CUT angular deviation | 5 Angular |
| V-CUT Board Thickness | 0.6MM-3.2MM |
| E-test Voltage | 50-250V |
| Permitivity | ε=2.1~10.0 |
| Thermal conductivity | 0.8-8W/M.K |
Applications:
Application fields of alumina ceramic circuit board, aluminum nitride ceramic circuit board and silicon nitride ceramic circuit board:
Automotive electronics, optoelectronic communication, communication antennas, automotive igniters, high-power power semiconductor modules, solar panels, electronic heaters, power control circuits, power hybrid circuits, intelligent power components, lithium batteries, high-frequency switching power supplies, solid state relays, Aerospace, industrial control, vehicle power modules, RF modules, medical equipment, consumer electronics, high-power LED lighting, rail transit, security electronics, new energy vehicles and many other fields.