All Categories
Great PCB Technology Co.,Ltd.
Ceramic Substrate Circuit Board

Aluminum Nitride Ceramic Circuit Board Has High Carbon Resistance

Ceramic Substrate Circuit Board

96 Alumina Ceramic PCB

Ceramic Substrate Circuit Board

Ceramic Base PCB Board With Immersion Gold

Ceramic Substrate Circuit Board

Single-sided Ceramic Based PCB Board

Ceramic Substrate Circuit Board
Ceramic Substrate Circuit Board
Ceramic Substrate Circuit Board
Ceramic Substrate Circuit Board

Ceramic Substrate Circuit Board

Ceramic base PCB is refers to the joint directly to the copper foil in the high temperature alumina (Al2O3), aluminum nitride (AlN) and silicon nitride ceramic substrate (Si3N4) of special craft board, including ceramic substrate materials for its high strength, excellent insulation performance, good heat resistance, small thermal expansion coefficient of thermal conductivity, good chemical stability, etc are widely used in electronic packaging substrate.

Manufacturing Capacity

Advantages of ceramic substrate
Different from the traditional glass fiber FR4 substrate, the ceramic material has good high-frequency performance and electrical performance, and has high thermal conductivity, chemical stability, excellent thermal stability and other characteristics that other ordinary substrates do not have.
● High thermal conductivity and high temperature resistance
● Smaller coefficient of thermal expansion.
● Stronger and lower resistance.
● Good insulation performance.
● Low high-frequency loss.
● Excellent thermal stability.

Alumina substrate features:
● Good surface characteristics, providing excellent flatness and flatness.
● Good thermal shock resistance.
● Excellent oil and chemical resistance.
● Low warpage.
● Good stability in high temperature environment.
● Can be processed into various complex shapes.

Aluminum nitride substrate characteristics:
● High thermal conductivity, more than 5 times that of alumina.
● Low coefficient of thermal expansion, which can effectively reduce the thermal stress caused by thermal expansion.
● Higher electrical insulation and smaller dielectric constant.
● High mechanical strength and density.
● Excellent corrosion resistance to molten metal.
● Low dielectric loss and more stable reliability.

Silicon nitride substrate features:
● Has high thermal conductivity
● Good electrical insulation, high hardness
● Low dielectric constant and dielectric loss
● Excellent mechanical strength and thermal shock resistance
● Good anti-oxidation performance and good hot corrosion performance.
● High mechanical strength and density.

ItemMaunfacturing Capability
Material base

Aluminium core PCB, Cu core PCB,

Fe base PCB,Ceramic PCB etc Special Material(5052,6061,6063)

Surface TreatmentHASL, HASL L/F,ENIG,PlatingNi/Au,NiPdAu,Plating Sliver,Immersion Sliver, Immersion Tin,OSP,Flux
No.of LayerSingle-sided, Double-sided,4 layer Aluminium Base PCB
Board Sizemax:1200*550MM / min:5*5MM
Conductor Width/spacing0.15MM/0.15MM
Warp and Twist≤0.75%
Board Thickness0.6MM-6.0MM
Copper Thickness35UM、70UM、105UM、140UM、210UM
Remain Thickness Tolerance±0.1MM
Hole Wall Copper Thickness≥18UM
PTH Hole Dia.Tolerance±0.076MM
NPTH Tolerance±0.05MM
Min.Hole Size0.2mm
Min. Punch hole Dimension0.8MMM
Min. Punch Slot Dimension0.8MM*0.8MM
Hole Position Deviation±0.076mm
Outline Tolerance±10%
Min.BGA Pitch PAD20mil
Min. legend Type0.15MM
Soldemask Layer Min.Bridge width5mil
Soldemask film Min.Thickness10mil
V-CUT angular deviation5 Angular
V-CUT Board Thickness0.6MM-3.2MM
E-test Voltage50-250V
Thermal conductivity0.8-8W/M.K

Application fields of alumina ceramic circuit board, aluminum nitride ceramic circuit board and silicon nitride ceramic circuit board:
Automotive electronics, optoelectronic communication, communication antennas, automotive igniters, high-power power semiconductor modules, solar panels, electronic heaters, power control circuits, power hybrid circuits, intelligent power components, lithium batteries, high-frequency switching power supplies, solid state relays, Aerospace, industrial control, vehicle power modules, RF modules, medical equipment, consumer electronics, high-power LED lighting, rail transit, security electronics, new energy vehicles and many other fields.