Heavy Copper PCB
Our are professional technology research and development team and production experience to manufacturing Heavy Copper boards to be produced up to 20 layers.
We have produce a lot of 25oz per layer with two-sided layer for extreme Heavy Copper pcb on this year. Application to High power planar transformers, Battery Charger and Monitoring Systems, etc...
Manufacturing Capacity
Definition of Heavy copper circuit board
Heavy copper circuit board refers to the printed circuit board with copper thickness ≥ 2oz on the inner or outer layer. Under the condition of standardizing the design circuit line width and line spacing, increasing the copper thickness is equivalent to increasing the circuit cross-sectional area, which can carry larger Current, copper foil has a small electrical conductivity, and the temperature rise is small under the condition of high current, so the heat generation can be reduced, thereby reducing thermal strain, in addition, copper foil also has high thermal conductivity (thermal conductivity 401W/mK), It can play an important role in improving the heat dissipation performance, so the thick copper circuit board has the characteristics of carrying large current, reducing thermal strain and good heat dissipation.
Copper Inlay PCB
Copper inlay PCB is made of FR4 and heat-dissipating metal materials(MCPCB). This process is realized by embedding copper metal in the circuit board. The heat emitted by the heating element installed on the circuit board can be embedded into the radiator on the bottom side through copper.
Engineer | Item | Manufacturing Capability | ||||||||||||
Material | Type | FR-4,HIGH TG FR-4-TG170/TG180,CEM-3,Halogen- Free,Rogers,Arlon,Taconic,Isola,PTFE, Bergquist,Polyimide, Aluminum base, Copper base,Heavy copper foil | ||||||||||||
Thickness | 0.2mm~10mm | |||||||||||||
Production Type | Surface Treatment | HASL,HASL lead-free,HAL,Flash gold,immersion gold,OSP,Gold Finger Palting,Selective thick gold plating, immersion silver,immersion tin, Carbon ink,peelable mask | ||||||||||||
No.of Layer | 1L-56L | |||||||||||||
Cut Lamination | Working Panel Size | Max:650mm×1200mm | ||||||||||||
Inner Layer | Inner Core thickness | 0.1~2.0mm | ||||||||||||
Conductor Width/spacing | Min:3/3mil | |||||||||||||
Alignment | 2.0mil | |||||||||||||
Dimension | Board Thickness Tolerance | ±10﹪ | ||||||||||||
Inter layer Alignment | ±3mil | |||||||||||||
Drilling | Drilling Diameter | Min:0.15MM (Laser Drill:0.1MM) | ||||||||||||
PTH Tolerance | ±0.075mm | |||||||||||||
NPTH Tolerance | ±0.05mm | |||||||||||||
Hole Position Tolerance | ±0.076mm | |||||||||||||
PTH+Panel Plating | Hole Wall Copper Thickness | ≥20um | ||||||||||||
Uniformity | ≥90% | |||||||||||||
Aspect Ratio | 12:01 | |||||||||||||
Outer Layer | Conductor Width | Min:3mil | ||||||||||||
Conductor Spacing | Min:3mil | |||||||||||||
Pattern Plating | Finished Copper Thickness | 1oz~10oz | ||||||||||||
Etching | Under Cut | ≥2.0 | ||||||||||||
EING/FLASH GOLD | Nickel Thickness | ≥100u″ | ||||||||||||
Gold Thickness | 1~3u″ | |||||||||||||
Solder Mask | Thickness | 10~25um | ||||||||||||
Solder Mask Bridge | 4mil | |||||||||||||
Plug Hole Dia | 0.3~0.6mm | |||||||||||||
Solder Mask Color | Green, Matte Green,White,Matte White,Black,Matte Black,Yellow,Red,Blue, Transparent ink | |||||||||||||
Silkscreen Color | White, Black, Yellow, Red, Blue | |||||||||||||
Legend | Line Width/Line Spacing | 5/5mil | ||||||||||||
Gold Finger | Nickel Thickness | ≥120u″ | ||||||||||||
Gold Thickness | 1~80u″ | |||||||||||||
Hot Air Level | Tin Thickness | 100-300u″ | ||||||||||||
OSP | Membrane Thickness | 0.2~0.4um | ||||||||||||
Routing | Tolerance of Dimension | ±0.1mm | ||||||||||||
Slot size | Min:0.6mm | |||||||||||||
Cutter Diameter | 0.8mm-2.4mm | |||||||||||||
Punching | Outline Tolerance | ±0.1mm | ||||||||||||
Slot Size | Min:0.7mm | |||||||||||||
V-CUT | V-CUT Dimension | Min:60mm | ||||||||||||
Angle | 15°30°45° | |||||||||||||
Remain Thickness Tolerance | ±0.1mm | |||||||||||||
Beveling | Beveling Dimension | 30-300mm | ||||||||||||
Test | Testing Voltage | 250V | ||||||||||||
Max.Dimension | 540×400mm | |||||||||||||
Impedance Control | Tolerance | ±10% | ||||||||||||
Peel Strength | 1.4N/mm | |||||||||||||
Applications:
As automotive electronics, battery charger and monitoring system, power planar transformer and the rapid development of electric power communication technology, more than 5 oz to 20 oz and gradually become a kind of super thick copper foil board has a broad market prospect of application, the special PCB printed circuit board not only for the electrical connection in the electronic components to provide necessary and mechanical support, Also can provide high current and high reliability of ultra thick copper foil printed board.
Applications of Heavy copper pcb: Aerospace, Satellite Communication, Network base load station, Hybrid integrated circuit, Power supply automotive electronics, Battery charger and monitoring system, Power planar transformer, Electric vehicle charging solution infrastructure, Charging Station or Charging Point,Led Lighting and other high-tech field.