We have a professional high-frequency circuit board technology research and development team and production experience, usually the low dielectric constant Dk, low dissipation factor Df, and low coefficient of thermal expansion CTE of high-frequency circuit board raw materials, provide faster signal flow for frequencies up to 100 GHz for domestic and imported high-frequency boards of different specifications (FR4, F4B, TP-2, Rogers, TACONIC, ARLON, Isola, NELCO, Panasonic, TUC).
If you want to reduce costs, FR4 is the less expensive, same have more most expensive material for fabricating high frequency PCBs. but the high frequency performance of FR4 is rather limited, we typically use these new raw materials to production HF PCBs.
Special Printed Circuit Board Laminate raw Materials:
ROGERS：RO3003, RO4003C，RO4350B，RO5880, RO4450B, etc...
TACONIC： TLC-30， TLE-95, RF-30, RF-35, TLY-5A, etc...
ARLON： 33N, 35N, 85N, 37N, 51N, HF-50, etc...
ISOLA： 370HR，408HR, FR406，P95，P96, etc...
NELCO： N4000-6，N4000-12， N4000-13, N4000-13EPSI, etc...
Panasonic: Megtron4, Megtron6, etc...
TUC: TUC862, 872SLK, 883, 933. ect...
The basic characteristics of high-frequency substrate materials are as follows:
(1) The dielectric constant (Dk) must be small and stable. Usually, the smaller the better, the better the transmission rate of the signal is inversely proportional to the square root of the dielectric constant of the material. High dielectric constant can easily cause signal transmission delay.
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission. The smaller the dielectric loss, the smaller the signal loss.
(3) The thermal expansion coefficient of the copper foil is as consistent as possible, because the inconsistency will cause the copper foil to separate during the change of cold and heat.
(4) Low water absorption and high water absorption will affect the dielectric constant and dielectric loss when wet.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Generally speaking, high frequency can be defined as the frequency above 1GHz. At present, the most commonly used high frequency circuit board substrates are fluorine dielectric substrates, such as polytetrafluoroethylene (PTFE), usually called Teflon, which is usually used in Above 5GHz. In addition, FR-4 is also used, which can be used for products between 1GHz and 10GHz.
|Material||Type||FR-4，HIGH TG FR-4-TG170/TG180，CEM-3,Halogen- Free,Rogers,Arlon,Taconic,Isola,PTFE, Bergquist,Polyimide, Aluminum base, Copper base,Heavy copper foil|
|Production Type||Surface Treatment||HASL，HASL lead-free,HAL,Flash gold,immersion gold,OSP,Gold Finger Palting,Selective thick gold plating, immersion silver,immersion tin, Carbon ink,peelable mask|
|Cut Lamination||Working Panel Size||Max:650mm×1200mm|
|Inner Layer||Inner Core thickness||0.1～2.0mm|
|Dimension||Board Thickness Tolerance||±10﹪|
|Inter layer Alignment||±3mil|
|Drilling||Drilling Diameter||Min:0.15MM (Laser Drill:0.1MM)|
|Hole Position Tolerance||±0.076mm|
|PTH+Panel Plating||Hole Wall Copper Thickness||≥20um|
|Outer Layer||Conductor Width||Min:3mil|
|Pattern Plating||Finished Copper Thickness||1oz～10oz|
|EING/FLASH GOLD||Nickel Thickness||≥100u″|
|Solder Mask Bridge||4mil|
|Plug Hole Dia||0.3～0.6mm|
|Solder Mask Color||Green, Matte Green,White,Matte White,Black,Matte Black,Yellow,Red,Blue, Transparent ink|
|Silkscreen Color||White, Black, Yellow, Red, Blue|
|Legend||Line Width/Line Spacing||5/5mil|
|Gold Finger||Nickel Thickness||≥120u″|
|Hot Air Level||Tin Thickness||100-300u″|
|Routing||Tolerance of Dimension||±0.1mm|
|Remain Thickness Tolerance||±0.1mm|
As the current high frequency of electronic equipment is a development trend, especially in the increasing development of wireless networks and satellite communications, information products are moving towards high-speed and high-frequency, and communication products are moving towards large-capacity and fast wireless transmission of voice, video and data. Standardization, so the development of a new generation of products requires high-frequency substrates, and communication products such as satellite systems and mobile phone receiving base stations must use high-frequency circuit boards.
Application industries include: 5G antenna, telecommunication, base station, RF antenna, wireless local area network, terminal, satellite navigation, medical nuclear magnetic resonance, wireless charging, RFID, ETC, UAV, automotive radar, smart label and other fields.