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High-Frequency PCB

Taconic High-frequency PCB

High-Frequency PCB

10 Layer High-frequency PCB

High-Frequency PCB

Rogers-4350+FR4-TG170 Hybrid Structure PCB With Impedance Control

High-Frequency PCB

Arlon High-Frequency PCB

High-Frequency PCB

High-frequency PCB

High-Frequency PCB

Rogers-5880+FR4-TG170 Hybrid Structure HF PCB

High-Frequency PCB
High-Frequency PCB
High-Frequency PCB
High-Frequency PCB
High-Frequency PCB
High-Frequency PCB

High-Frequency PCB

We have a professional high-frequency circuit board technology research and development team and production experience, usually the low dielectric constant Dk, low dissipation factor Df, and low coefficient of thermal expansion CTE of high-frequency circuit board raw materials, provide faster signal flow for frequencies up to 100 GHz for domestic and imported high-frequency boards of different specifications (FR4, F4B, TP-2, Rogers, TACONIC, ARLON, Isola, NELCO, Panasonic, TUC).

Manufacturing Capacity

If you want to reduce costs, FR4 is the less expensive, same have more most expensive material for fabricating high frequency PCBs. but the high frequency performance of FR4 is rather limited, we typically use these new raw materials to production HF PCBs.
Special Printed Circuit Board Laminate raw Materials:
ROGERS:RO3003, RO4003C,RO4350B,RO5880, RO4450B, etc...
TACONIC: TLC-30, TLE-95, RF-30, RF-35, TLY-5A, etc...
ARLON: 33N, 35N, 85N, 37N, 51N, HF-50, etc...
ISOLA:  370HR,408HR, FR406,P95,P96, etc...
NELCO: N4000-6,N4000-12, N4000-13, N4000-13EPSI, etc...
Panasonic: Megtron4, Megtron6, etc...
TUC: TUC862, 872SLK, 883, 933. ect...

The basic characteristics of high-frequency substrate materials are as follows:
(1) The dielectric constant (Dk) must be small and stable. Usually, the smaller the better, the better the transmission rate of the signal is inversely proportional to the square root of the dielectric constant of the material. High dielectric constant can easily cause signal transmission delay.
(2) The dielectric loss (Df) must be small, which mainly affects the quality of signal transmission. The smaller the dielectric loss, the smaller the signal loss.
(3) The thermal expansion coefficient of the copper foil is as consistent as possible, because the inconsistency will cause the copper foil to separate during the change of cold and heat.
(4) Low water absorption and high water absorption will affect the dielectric constant and dielectric loss when wet.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Generally speaking, high frequency can be defined as the frequency above 1GHz. At present, the most commonly used high frequency circuit board substrates are fluorine dielectric substrates, such as polytetrafluoroethylene (PTFE), usually called Teflon, which is usually used in Above 5GHz. In addition, FR-4 is also used, which can be used for products between 1GHz and 10GHz.

EngineerItemManufacturing Capability
MaterialTypeFR-4,HIGH TG FR-4-TG170/TG180,CEM-3,Halogen- Free,Rogers,Arlon,Taconic,Isola,PTFE, Bergquist,Polyimide, Aluminum base, Copper base,Heavy copper foil
Production TypeSurface TreatmentHASL,HASL lead-free,HAL,Flash gold,immersion gold,OSP,Gold Finger Palting,Selective thick gold plating, immersion silver,immersion tin, Carbon ink,peelable mask
No.of Layer1L-56L
Cut LaminationWorking Panel SizeMax:650mm×1200mm
Inner LayerInner Core thickness0.1~2.0mm
Conductor Width/spacingMin:3/3mil
DimensionBoard Thickness Tolerance±10﹪
Inter layer Alignment±3mil
DrillingDrilling DiameterMin:0.15MM   (Laser Drill:0.1MM)
PTH Tolerance±0.075mm
NPTH Tolerance±0.05mm
Hole Position Tolerance±0.076mm
PTH+Panel PlatingHole Wall Copper Thickness≥20um
Aspect Ratio12:01
Outer LayerConductor WidthMin:3mil
Conductor SpacingMin:3mil
Pattern PlatingFinished Copper Thickness1oz~10oz
EtchingUnder Cut≥2.0
EING/FLASH GOLDNickel Thickness≥100u″
Gold Thickness1~3u″
Solder MaskThickness10~25um
Solder Mask Bridge4mil
Plug Hole Dia0.3~0.6mm
Solder Mask ColorGreen, Matte Green,White,Matte White,Black,Matte Black,Yellow,Red,Blue, Transparent ink
Silkscreen ColorWhite, Black, Yellow, Red, Blue
LegendLine Width/Line Spacing5/5mil
Gold FingerNickel Thickness≥120u″
Gold Thickness1~80u″
Hot Air LevelTin Thickness100-300u″
OSPMembrane Thickness0.2~0.4um
RoutingTolerance of Dimension±0.1mm
Slot sizeMin:0.6mm
Cutter Diameter0.8mm-2.4mm
PunchingOutline Tolerance±0.1mm
Slot SizeMin:0.7mm
V-CUTV-CUT DimensionMin:60mm
Remain Thickness Tolerance±0.1mm
BevelingBeveling Dimension30-300mm
TestTesting Voltage250V
Impedance ControlTolerance±10%
Peel Strength

As the current high frequency of electronic equipment is a development trend, especially in the increasing development of wireless networks and satellite communications, information products are moving towards high-speed and high-frequency, and communication products are moving towards large-capacity and fast wireless transmission of voice, video and data. Standardization, so the development of a new generation of products requires high-frequency substrates, and communication products such as satellite systems and mobile phone receiving base stations must use high-frequency circuit boards.
Application industries include: 5G antenna, telecommunication, base station, RF antenna, wireless local area network, terminal, satellite navigation, medical nuclear magnetic resonance, wireless charging, RFID, ETC, UAV, automotive radar, smart label and other fields.