Metal Clad Printed Circuit Board

The characteristics of Has good heat dissipation performance in circuit design.
Can reduce the temperature, improve the power density and reliability of products, prolong the service life of products;
Can reduce the volume, reduce hardware and assembly costs。
Compared to ceramic substrate, it has better mechanical endurance.
Thermal insulation layer is the core technology of PCB aluminum substrate. It is generally composed of special polymers filled with special ceramics，the max  thermal conductivity of insulation layer is 8W/Mk, and the thermal conductivity of thermoelectric separation substrate is 220-350W/m.K.
The metal base layer is the support member of the aluminum substrate, which requires high thermal conductivity, generally aluminum substrate and copper substrate (the copper substrate can provide better thermal conductivity), which is suitable for drilling, die stamping, gong plate, V-CUT, etc. Conventional machining.
Aluminum-based PCB copper clad laminate is a metal circuit board material, which consists of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:
Circuit layer: It is equivalent to the copper clad laminate of ordinary PCB, and the thickness of circuit copper foil is 1oz to 10oz.
Insulation layer: It is a layer of thermally conductive insulating material with low thermal resistance. Thickness: 0.003" to 0.006" inch is the core technology of aluminum-based copper clad laminate.
Substrate layer: It is a metal substrate, generally aluminum-based copper clad laminate or copper-based copper clad laminate, iron-based copper clad laminate.

Copper based PCB is relatively high in the price of metal substrate, thermal conductivity is many times better than aluminum based PCB and iron based PCB, suitable for high-frequency circuits and high and low temperature change areas and communication equipment and other electronic products requiring good heat dissipation.
Copper base PCB circuit layer with a large current carrying capacity, should use thicker copper foil, general 35 microns to 280 microns thickness, the core of thermal insulation material composition for the 3 oxidation 2 aluminium and silicon powder and epoxy resin filled polymer composition, thermal resistance small, can good viscoelastic, has the ability of thermal aging, able to withstand mechanical and thermal stress.
1, The thermal conductivity of copper based PCB is twice that of aluminum based PCB. The higher the thermal conductivity, the higher the heat conduction efficiency and the better the heat dissipation performance.
2, copper base can be processed into metallized holes, and aluminum base can not, the network of metallized holes must be the same network, so that the signal has good grounding performance, and the copper itself has weldable performance.
3, the copper base of the copper substrate can be etched into fine graphics, processing into the boss, components can be directly attached to the boss, to achieve excellent grounding and heat dissipation effect;
4, due to the difference of elastic modulus of copper and aluminum, the corresponding warpage and expansion and contraction of copper substrate will be smaller than that of aluminum substrate, and the overall performance is more stable.
5, due to the thick copper base, the design of the minimum drilling tool diameter must be 0.4mm, line width spacing according to the thickness of copper foil on the copper substrate to determine, the thicker the copper foil thickness, the need to adjust the width of the line is wider, the need to adjust the minimum spacing is greater.

Applications:
Products are widely used in audio amplifiers, power amplifiers, switching regulators, DC/AC converters, motor drivers, electronic regulators, power controllers, high-power modules, communications, power, electronics, automotive, medical equipment, automation equipment, 3D Equipment, home appliances, lighting and other fields.