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Great PCB Technology Co.,Ltd.
Metal Clad Printed Circuit Board

3OZ Thick Copper LED PCB

Metal Clad Printed Circuit Board

Metal Base PCB With Thermal Conductivity 2W m.k

Metal Clad Printed Circuit Board

OSP for Cu Base PCB

Metal Clad Printed Circuit Board

Single Side Copper Based Circuit Board

Metal Clad Printed Circuit Board

Aluminium Base PCB for Led Lighting

Metal Clad Printed Circuit Board

Thermoelectric Separation Copper Substrate Has Countersunk Head Holes

Metal Clad Printed Circuit Board
Metal Clad Printed Circuit Board
Metal Clad Printed Circuit Board
Metal Clad Printed Circuit Board
Metal Clad Printed Circuit Board
Metal Clad Printed Circuit Board

Metal Clad Printed Circuit Board

Aluminum - based circuit board is a unique metal - based copper-clad board, It consists of a circuit layer, a thermally conductive insulating layer and a metal base layer. The circuit layer (copper foil) is usually etched to form a printed circuit, so that the various components of the component are connected to each other. In general, the circuit layer is required to have a large current-carrying capacity, which should be considered Use thicker copper foilwhich has good thermal conductivity, electrical insulation and machining performance.

Manufacturing Capacity

The characteristics of Has good heat dissipation performance in circuit design.
Can reduce the temperature, improve the power density and reliability of products, prolong the service life of products;
Can reduce the volume, reduce hardware and assembly costs。
Compared to ceramic substrate, it has better mechanical endurance.
Thermal insulation layer is the core technology of PCB aluminum substrate. It is generally composed of special polymers filled with special ceramics,the max  thermal conductivity of insulation layer is 8W/Mk, and the thermal conductivity of thermoelectric separation substrate is 220-350W/m.K.
The metal base layer is the support member of the aluminum substrate, which requires high thermal conductivity, generally aluminum substrate and copper substrate (the copper substrate can provide better thermal conductivity), which is suitable for drilling, die stamping, gong plate, V-CUT, etc. Conventional machining.
Aluminum-based PCB copper clad laminate is a metal circuit board material, which consists of copper foil, thermal insulation layer and metal substrate. Its structure is divided into three layers:
Circuit layer: It is equivalent to the copper clad laminate of ordinary PCB, and the thickness of circuit copper foil is 1oz to 10oz.
Insulation layer: It is a layer of thermally conductive insulating material with low thermal resistance. Thickness: 0.003" to 0.006" inch is the core technology of aluminum-based copper clad laminate.
Substrate layer: It is a metal substrate, generally aluminum-based copper clad laminate or copper-based copper clad laminate, iron-based copper clad laminate.

ItemMaunfacturing Capability
Material base

Aluminium core PCB, Cu core PCB,                                        

Fe base PCB,Ceramic PCB etc Special Material(5052,6061,6063)

Surface TreatmentHASL, HASL L/F,ENIG,PlatingNi/Au,NiPdAu,Plating Sliver,Immersion Sliver, Immersion Tin,OSP,Flux
No.of LayerSingle-sided, Double-sided,4 layer Aluminium Base PCB
Board SizeMax:1200*550MM / min:5*5MM
Conductor Width/spacing0.15MM/0.15MM
Warp and Twist≤0.75%
Board Thickness0.6MM-6.0MM
Copper Thickness35UM、70UM、105UM、140UM、210UM
Remain Thickness Tolerance±0.1MM
Hole Wall Copper Thickness≥18UM
PTH Hole Dia.Tolerance±0.076MM
NPTH Tolerance±0.05MM
Min.Hole Size0.2mm
Min. Punch hole Dimension0.8MMM
Min. Punch Slot Dimension0.8MM*0.8MM
Hole Position Deviation±0.076mm
Outline Tolerance±10%
Min.BGA Pitch PAD20mil
Min. legend Type0.15MM
Soldemask Layer Min.Bridge width5mil
Soldemask film Min.Thickness10mil
V-CUT angular deviation5 Angular
V-CUT Board Thickness0.6MM-3.2MM
E-test Voltage50-250V
Thermal conductivity0.8-8W/M.K

Copper based PCB is relatively high in the price of metal substrate, thermal conductivity is many times better than aluminum based PCB and iron based PCB, suitable for high-frequency circuits and high and low temperature change areas and communication equipment and other electronic products requiring good heat dissipation.
Copper base PCB circuit layer with a large current carrying capacity, should use thicker copper foil, general 35 microns to 280 microns thickness, the core of thermal insulation material composition for the 3 oxidation 2 aluminium and silicon powder and epoxy resin filled polymer composition, thermal resistance small, can good viscoelastic, has the ability of thermal aging, able to withstand mechanical and thermal stress.
1, The thermal conductivity of copper based PCB is twice that of aluminum based PCB. The higher the thermal conductivity, the higher the heat conduction efficiency and the better the heat dissipation performance.
2, copper base can be processed into metallized holes, and aluminum base can not, the network of metallized holes must be the same network, so that the signal has good grounding performance, and the copper itself has weldable performance.
3, the copper base of the copper substrate can be etched into fine graphics, processing into the boss, components can be directly attached to the boss, to achieve excellent grounding and heat dissipation effect;
4, due to the difference of elastic modulus of copper and aluminum, the corresponding warpage and expansion and contraction of copper substrate will be smaller than that of aluminum substrate, and the overall performance is more stable.
5, due to the thick copper base, the design of the minimum drilling tool diameter must be 0.4mm, line width spacing according to the thickness of copper foil on the copper substrate to determine, the thicker the copper foil thickness, the need to adjust the width of the line is wider, the need to adjust the minimum spacing is greater.

Products are widely used in audio amplifiers, power amplifiers, switching regulators, DC/AC converters, motor drivers, electronic regulators, power controllers, high-power modules, communications, power, electronics, automotive, medical equipment, automation equipment, 3D Equipment, home appliances, lighting and other fields.